Soldered product manufacturing apparatus and method for manufacturing soldered product
The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.06.2024
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Subjects | |
Online Access | Get full text |
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Abstract | The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the stage 13 and cover 16, a heating unit 15 for heating the substrate W on the stage 13, and a reducing gas supply device 19 for supplying a reducing gas F. The method for manufacturing a soldered product uses the soldered product manufacturing apparatus 1, and is, providing a substrate W on a stage 13, covering the substrate W placed on the stage 13 with a cover 16, heating the substrate W, and supplying a reducing gas F into the chamber 11. |
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AbstractList | The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the stage 13 and cover 16, a heating unit 15 for heating the substrate W on the stage 13, and a reducing gas supply device 19 for supplying a reducing gas F. The method for manufacturing a soldered product uses the soldered product manufacturing apparatus 1, and is, providing a substrate W on a stage 13, covering the substrate W placed on the stage 13 with a cover 16, heating the substrate W, and supplying a reducing gas F into the chamber 11. |
Author | OZAWA, NAOTO SUZUKI, TAKAYUKI MARUYAMA, MEGU MATSUDA, JUN NAGAHAMA, MASANOBU |
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Notes | Application Number: TW20209124953 |
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Snippet | The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Soldered product manufacturing apparatus and method for manufacturing soldered product |
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