Soldered product manufacturing apparatus and method for manufacturing soldered product

• Main Authors: MATSUDA, JUN, SUZUKI, TAKAYUKI, NAGAHAMA, MASANOBU, MARUYAMA, MEGU, OZAWA, NAOTO
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the stage 13 and cover 16, a heating unit 15 for heating the substrate W on the stage 13, and a reducing gas supply device 19 for supplying a reducing gas F. The method for manufacturing a soldered product uses the soldered product manufacturing apparatus 1, and is, providing a substrate W on a stage 13, covering the substrate W placed on the stage 13 with a cover 16, heating the substrate W, and supplying a reducing gas F into the chamber 11.