TWI842957B

• Main Authors: UMEMURA, SHIGEKAZU, ISOBE, OSAMU
• Format: Patent
• Language: Chinese
• Published: 21.05.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer.　An electromagnetic wave shielding film according to the present invention is obtained by sequentially stacking a first insulating layer, a silver nanowire layer, a second insulating layer and a conductive adhesive layer in this order; the second insulating layer has a thickness of from 50 nm to 500 nm; the conductive adhesive layer contains a binder component and spherical or dendritic conductive particles; and the content ratio of the conductive particles relative to 100% by mass of the conductive adhesive layer is from 1% by mass to 80% by mass.