TWI842957B
The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer. An electromagnetic wave shielding film according to the...
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Main Authors | , |
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Format | Patent |
Language | Chinese |
Published |
21.05.2024
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Subjects | |
Online Access | Get full text |
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Abstract | The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer. An electromagnetic wave shielding film according to the present invention is obtained by sequentially stacking a first insulating layer, a silver nanowire layer, a second insulating layer and a conductive adhesive layer in this order; the second insulating layer has a thickness of from 50 nm to 500 nm; the conductive adhesive layer contains a binder component and spherical or dendritic conductive particles; and the content ratio of the conductive particles relative to 100% by mass of the conductive adhesive layer is from 1% by mass to 80% by mass. |
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AbstractList | The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer. An electromagnetic wave shielding film according to the present invention is obtained by sequentially stacking a first insulating layer, a silver nanowire layer, a second insulating layer and a conductive adhesive layer in this order; the second insulating layer has a thickness of from 50 nm to 500 nm; the conductive adhesive layer contains a binder component and spherical or dendritic conductive particles; and the content ratio of the conductive particles relative to 100% by mass of the conductive adhesive layer is from 1% by mass to 80% by mass. |
Author | ISOBE, OSAMU UMEMURA, SHIGEKAZU |
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Notes | Application Number: TW20209133414 |
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RelatedCompanies | TATSUTA ELECTRIC WIRE & CABLE CO., LTD |
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Snippet | The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
Title | TWI842957B |
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