TWI842957B

The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer.　An electromagnetic wave shielding film according to the...

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Bibliographic Details
Main Authors UMEMURA, SHIGEKAZU, ISOBE, OSAMU
Format Patent
LanguageChinese
Published 21.05.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides an electromagnetic wave shielding film which has excellent transparency and a low electrical connection resistance value even if a large amount of conductive particles are blended into a conductive adhesive layer.　An electromagnetic wave shielding film according to the present invention is obtained by sequentially stacking a first insulating layer, a silver nanowire layer, a second insulating layer and a conductive adhesive layer in this order; the second insulating layer has a thickness of from 50 nm to 500 nm; the conductive adhesive layer contains a binder component and spherical or dendritic conductive particles; and the content ratio of the conductive particles relative to 100% by mass of the conductive adhesive layer is from 1% by mass to 80% by mass.
Bibliography:Application Number: TW20209133414