TWI840507B

• Main Authors: MURAKAWA, AKIRA, FUKAZAWA, NORIMASA, SHIRAKAMI, JUN, NIIBAYASHI, SHOTA
• Format: Patent
• Language: Chinese
• Published: 01.05.2024
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NATURAL RESINS; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PAINTS; POLISHES; PRINTED CIRCUITS

The present invention provides an etching liquid for silver, which is an aqueous solution containing a carboxylic acid, hydrogen peroxide and an alcohol. The present invention also provides a method for producing a printed wiring board, the method having a step for forming a silver layer (M1) as a plating underlayer on an insulating base material (A) and then removing unwanted parts of the silver layer (M1) using the etching liquid for silver. By using the etching liquid for silver, it is possible to efficiently remove unwanted plating underlayer in the production of a printed wiring board in which silver is used in the plating underlayer, and obtain a printed wiring board having little side etching and undercutting in wiring parts of the printed wiring board.