SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF

The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a substrate, a fixing glue layer disposed on the substrate, a sensor chip adhered to the fixing glue layer, an annular bonding layer disposed on the sensor chip, a ligh...

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Bibliographic Details
Main Authors YU, WEN-FU, WANG, WEI-LI, LIN, CHIEN-HUNG, CHANG, CHIA-SHUAI, HWANG, BAE-YINN
Format Patent
LanguageChinese
English
Published 21.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a substrate, a fixing glue layer disposed on the substrate, a sensor chip adhered to the fixing glue layer, an annular bonding layer disposed on the sensor chip, a light permeable sheet adhered to the annular bonding layer, and a plurality of metal wires electrically coupled to the substrate and the sensor chip. The size of the light permeable sheet is smaller than that of the sensor chip.
Bibliography:Application Number: TW202312108427