SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a circuit layer, and a plurality of contacts electrically connecting the circuit layer to the carrier. Each contact includes a metal portion and an insulating portion. The insulating portion surrou...

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Bibliographic Details
Main Author HUANG, YU-WEI
Format Patent
LanguageChinese
English
Published 11.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a circuit layer, and a plurality of contacts electrically connecting the circuit layer to the carrier. Each contact includes a metal portion and an insulating portion. The insulating portion surrounds the metal portion. A gap is formed between the contacts.
Bibliography:Application Number: TW202312100022