Tape structure

An tape structure includes a base film, a black ink layer, a first adhesive layer, a metal layer, and a second adhesive layer. The black ink layer is disposed on the base film. The first adhesive layer is disposed on the black ink layer. The metal layer is disposed on the first adhesive layer. The s...

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Bibliographic Details
Main Authors LIN, CHIN-KAI, HUANG, CHI-HUA, CHEN, CHUN-FA, XIE, SHI ROU, LEE, CHEN-JU
Format Patent
LanguageChinese
English
Published 01.02.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:An tape structure includes a base film, a black ink layer, a first adhesive layer, a metal layer, and a second adhesive layer. The black ink layer is disposed on the base film. The first adhesive layer is disposed on the black ink layer. The metal layer is disposed on the first adhesive layer. The second adhesive layer is disposed on the metal layer.
Bibliography:Application Number: TW202110111463