TWI829253B

• Main Authors: TAHARA, KANA, MURAMOTO, RYO, INABA, MASAKI
• Format: Patent
• Language: Chinese
• Published: 11.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

A substrate processing apparatus includes a substrate holding member that holds a substrate in a predetermined processing posture, a polymer film forming member that forms a polymer film that contains a photoacid generator that generates an acid by light irradiation and that contains a polymer on a first principal surface of the substrate held by the substrate holding member, a light emission member that emits light and that irradiates light onto a peripheral edge portion of the first principal surface of the substrate held by the substrate holding member, and a reflection suppression member including a first portion that is placeable at an adjoining position that adjoins an irradiation region, onto which light from the light emission member is irradiated, of the peripheral edge portion of the first principal surface of the substrate held by the substrate holding member from a center portion side of the first principal surface of the substrate.