TWI827863B
Provided are an inspection device and method with which it is possible to automatically inspect comparatively large scratches or fouling, adhesion of foreign matter, etc., which is a category of macro inspection, on the basis of an enlarged image of a small segment, the image being acquired for the...
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| Main Author | |
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| Format | Patent |
| Language | Chinese |
| Published |
01.01.2024
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| Subjects | |
| Online Access | Get full text |
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| Summary: | Provided are an inspection device and method with which it is possible to automatically inspect comparatively large scratches or fouling, adhesion of foreign matter, etc., which is a category of macro inspection, on the basis of an enlarged image of a small segment, the image being acquired for the purpose of micro inspection. Specifically, provided are a wafer appearance inspection device and method for capturing an image of the appearance of a wafer on which a repeating pattern is formed and performing an inspection by comparing the captured image and a preregistered reference image, wherein: split imaging is performed on the repeating pattern formed on a wafer to be inspected while an imaging location is successively changed; after images acquired through the split imaging are combined to generate a large-sized inspection image for macro inspection, the large-sized inspection image for macro inspection is compressed to generate a small-sized inspection image for macro inspection; and the small-sized inspec |
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| Bibliography: | Application Number: TW20209123702 |