Potting composition, method for the electrical insulation of an electrical or electronic component, and electrically insulated component

• Main Authors: HEJTMANN, GEORG, HENNECK, STEFAN, KAESSNER, STEFAN
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2024
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention relates to a potting compound. Said potting compound contains 5.0-30.0 wt.% reactive particles, selected from magnesium oxide particles with a maximum particle size of 5.0 µm, porous magnesium oxide particle agglomerates, silicon oxide particles with a maximum particle size of 0.5 µm, silica particles with a maximum particle size of 0.5 µm and mixtures thereof, 45.0-90.0 wt.% filler particles with a particle size exceeding 1 µm and/or filler fibres, and 5.0-20.0 wt.% water. The component is potted using the potting compound (11) in a method for electrically isolating an electrical or electronic component. Said component is then heat-treated at a temperature ranging from 50°C to 95°C in an atmosphere saturated with water (12) and dried. An electrically isolated component can be produced in this way.