TWI826562B

• Main Authors: CHEN, SHU YOU, SU, HUNG WEN, TSAI, JUNG HSUN, YU, CHING HAN
• Format: Patent
• Language: Chinese
• Published: 21.12.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

An objective of the present invention is to provide a photosensitive resin composition, a cured article thereof, and a printed wiring board using the same, wherein the photosensitive resin composition has excellent image resolution and is capable shortening development time even when it possesses high dielectric constant. The solution is a photosensitive resin composition, which is characterized by comprising a resin containing a hydroxyl group, barium titanate and/or titanium oxide and a dispersant, wherein the aforementioned barium titanate and/or titanium oxide have an average particle size that exceeds 0.1 [mu]m and below 1 [mu]m, and the dispersant is a compound having an amine value of 40-50 mgKOH/g and an acid value of 30-50 mgKOH/g.