TWI826562B

An objective of the present invention is to provide a photosensitive resin composition, a cured article thereof, and a printed wiring board using the same, wherein the photosensitive resin composition has excellent image resolution and is capable shortening development time even when it possesses hi...

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Bibliographic Details
Main Authors CHEN, SHU YOU, SU, HUNG WEN, TSAI, JUNG HSUN, YU, CHING HAN
Format Patent
LanguageChinese
Published 21.12.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:An objective of the present invention is to provide a photosensitive resin composition, a cured article thereof, and a printed wiring board using the same, wherein the photosensitive resin composition has excellent image resolution and is capable shortening development time even when it possesses high dielectric constant. The solution is a photosensitive resin composition, which is characterized by comprising a resin containing a hydroxyl group, barium titanate and/or titanium oxide and a dispersant, wherein the aforementioned barium titanate and/or titanium oxide have an average particle size that exceeds 0.1 [mu]m and below 1 [mu]m, and the dispersant is a compound having an amine value of 40-50 mgKOH/g and an acid value of 30-50 mgKOH/g.
Bibliography:Application Number: TW20198139181