TWI825019B

Provided are a material for molding in binder jetting that permits pouring a refractory metal having a melting point exceeding 1400°C, and a functional agent. A material for molding in binder jetting that includes an aggregate and a powdery precursor of a binder for binding the aggregate together, w...

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Bibliographic Details
Main Authors INOIE, HIROSHI, INOIE, MIKI, USHIMARU, YUKIHIRO, INOIE, SHOHACHI
Format Patent
LanguageChinese
Published 11.12.2023
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Summary:Provided are a material for molding in binder jetting that permits pouring a refractory metal having a melting point exceeding 1400°C, and a functional agent. A material for molding in binder jetting that includes an aggregate and a powdery precursor of a binder for binding the aggregate together, wherein the material for molding includes a foundry sand of the aggregate and a curing component and a curing-accelerating component of the powdery precursor.
Bibliography:Application Number: TW20187117029