TWI825019B
Provided are a material for molding in binder jetting that permits pouring a refractory metal having a melting point exceeding 1400°C, and a functional agent. A material for molding in binder jetting that includes an aggregate and a powdery precursor of a binder for binding the aggregate together, w...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese |
Published |
11.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Provided are a material for molding in binder jetting that permits pouring a refractory metal having a melting point exceeding 1400°C, and a functional agent. A material for molding in binder jetting that includes an aggregate and a powdery precursor of a binder for binding the aggregate together, wherein the material for molding includes a foundry sand of the aggregate and a curing component and a curing-accelerating component of the powdery precursor. |
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Bibliography: | Application Number: TW20187117029 |