TWI824998B

A resin composition characterized by including a (meth)acrylic polymer having a Tg of -40°C or lower obtained by polymerizing a monomer component including an alkyl (meth)acrylate (a1), the Tg of a homopolymer of which is -50°C or lower, that has a C8-18 branched alkyl group at the end of the ester...

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Bibliographic Details
Main Authors HIGASHI, MASATSUGU, TOSAKI, YUTAKA
Format Patent
LanguageChinese
Published 11.12.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:A resin composition characterized by including a (meth)acrylic polymer having a Tg of -40°C or lower obtained by polymerizing a monomer component including an alkyl (meth)acrylate (a1), the Tg of a homopolymer of which is -50°C or lower, that has a C8-18 branched alkyl group at the end of the ester group and a (meth)acrylate (a2), the Tg of a homopolymer of which is -40°C or lower, that has an ether bond within the molecular skeleton. The resin composition can achieve both high adhesive strength and high holding power to an adherend having a rough surface.
Bibliography:Application Number: TW20176122789