ULTRASONIC FINGERPRINT IDENTIFICATION DEVICE
The invention provides an ultrasonic fingerprint identification device. The ultrasonic fingerprint identification device comprises: a conductive layer and a piezoelectric material layer. The conductive layer has a plurality of layout metals and a conductive pad, and the layout metals are made into a...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides an ultrasonic fingerprint identification device. The ultrasonic fingerprint identification device comprises: a conductive layer and a piezoelectric material layer. The conductive layer has a plurality of layout metals and a conductive pad, and the layout metals are made into a larger width, and the width is between 10 micrometers and 150 micrometers. The piezoelectric material layer is located on the conductive layer, and the piezoelectric material layer covers all the layout metal and part of the conductive pad, so as to solve the problem of air bubbles caused by making a transparent conductive layer on the piezoelectric material and reduce the Product defects, in order to increase the efficiency of product yield. |
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Bibliography: | Application Number: TW202211136647 |