Fluorine-containing resin-based resin composition and application thereof

• Main Authors: LIU, QIAN FA, HAO, LIANG PENG, CHAI, SONG GANG, LIANG, WEI, XU, YONG JING
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention provides a fluorine-containing resin-based resin composition and an application thereof. The fluorine-containing resin-based resin composition comprises, in parts by weight, 20-70 parts of polytetrafluoroethylene emulsion and 30-70 parts of silicon dioxide; the silicon dioxide is prepared by means of an organic silicon hydrolysis method; and the purity of the silicon dioxide is greater than 99.99%. The fluorine-containing resin-based resin composition and a plate containing same have excellent insulation performance and dielectric performance, lower dielectric constant and dielectric loss, and high breakdown voltage, such that a copper-clad plate has excellent dielectric performance and voltage resistance, and fully satisfies various performance requirements of a high-frequency communication device on copper-clad plate materials.