Electronic device and method for fabricating the same

A method for fabricating an electronic device is provided. The method includes the following steps. A substrate is provided. A solder and a flux are formed on the substrate. An electronic component is bonded on the solder. At least a portion of the flux is removed. An electronic device is also provi...

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Bibliographic Details
Main Authors NIEN, CHUEH-YUAN, SUNG, CHAOIN, CHU, CHIEN-TZU, YANG, CHAO-SEN
Format Patent
LanguageChinese
English
Published 01.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fabricating an electronic device is provided. The method includes the following steps. A substrate is provided. A solder and a flux are formed on the substrate. An electronic component is bonded on the solder. At least a portion of the flux is removed. An electronic device is also provided.
Bibliography:Application Number: TW202211119097