Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition including the same

• Main Authors: YOON, KYONG JUN, KANG, HYEON UK, BYUN, DO HYUN
• Format: Patent
• Language: Chinese; English
• Published: 21.11.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.