TWI822841B

• Main Authors: KUBO, AKIKO, TAKEDA, KOUHEI, WAKIOKA, SAYAKA, SHINDO, MASAMI, ARAI, YOSHITO, HAYASHI, TATSUSHI, OOATARI, YUUTA, KAWAHARA, YUKO
• Format: Patent
• Language: Chinese
• Published: 21.11.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

Provided is a resin material that can (1) increase the homogeneity of surface roughness after etching, (2) increase the dimensional stability under heat when in a cured form, (3) increase plating peel strength, (4) increase embeddability in a contoured surface, and (5) suppress excessive protrusion from a substrate periphery during lamination. This resin material includes a maleimide compound with a framework derived from a dimer diamine or a framework derived from a trimer triamine, and the glass transition temperature of the maleimide compound is 80°C or higher.