TWI822841B

Provided is a resin material that can (1) increase the homogeneity of surface roughness after etching, (2) increase the dimensional stability under heat when in a cured form, (3) increase plating peel strength, (4) increase embeddability in a contoured surface, and (5) suppress excessive protrusion...

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Bibliographic Details
Main Authors KUBO, AKIKO, TAKEDA, KOUHEI, WAKIOKA, SAYAKA, SHINDO, MASAMI, ARAI, YOSHITO, HAYASHI, TATSUSHI, OOATARI, YUUTA, KAWAHARA, YUKO
Format Patent
LanguageChinese
Published 21.11.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
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Summary:Provided is a resin material that can (1) increase the homogeneity of surface roughness after etching, (2) increase the dimensional stability under heat when in a cured form, (3) increase plating peel strength, (4) increase embeddability in a contoured surface, and (5) suppress excessive protrusion from a substrate periphery during lamination. This resin material includes a maleimide compound with a framework derived from a dimer diamine or a framework derived from a trimer triamine, and the glass transition temperature of the maleimide compound is 80°C or higher.
Bibliography:Application Number: TW20198130677