TWI822841B
Provided is a resin material that can (1) increase the homogeneity of surface roughness after etching, (2) increase the dimensional stability under heat when in a cured form, (3) increase plating peel strength, (4) increase embeddability in a contoured surface, and (5) suppress excessive protrusion...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese |
Published |
21.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a resin material that can (1) increase the homogeneity of surface roughness after etching, (2) increase the dimensional stability under heat when in a cured form, (3) increase plating peel strength, (4) increase embeddability in a contoured surface, and (5) suppress excessive protrusion from a substrate periphery during lamination. This resin material includes a maleimide compound with a framework derived from a dimer diamine or a framework derived from a trimer triamine, and the glass transition temperature of the maleimide compound is 80°C or higher. |
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Bibliography: | Application Number: TW20198130677 |