Polymer for preparing resist underlayer film, resist underlayer film composition including the polymer and method for manufacturing semiconductor device using the composition

• Main Authors: LEE, NAM KYU, HWANG, SOO YOUNG, LEE, KYUN PHYO, LEE, KWANG HO, HAM, JIN SU, JUNG, MIN HO, LEE, HYE RYOUNG, LEE, KWANG KUK
• Format: Patent
• Language: Chinese; English
• Published: 21.11.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a polymer having a novel structure used in a process for manufacturing a semiconductor and a display; an underlayer film composition for a process for manufacturing a semiconductor and a display, including the same; and a method for manufacturing a semiconductor element by using the same. The novel polymer of the present invention has both optimized etch selection ratio and planarization properties and excellent heat resistance, and thus the underlayer film composition including the same can be used as a hard mask in a semiconductor multilayer lithography process.