Scalable network-on-package for connecting chiplet-based designs

A network-on-package (NoPK) for connecting a plurality of chiplets may include a plurality of interface bridges configured to convert a plurality of protocols used by the plurality of chiplets into a common protocol, a routing network configured to route traffic between the plurality of interface br...

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Bibliographic Details
Main Authors SHEIKH, BILAL SHAFI, SHAK, MYRON, SURI, TAMEESH, ZAMAN, NAVEED
Format Patent
LanguageChinese
English
Published 01.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Summary:A network-on-package (NoPK) for connecting a plurality of chiplets may include a plurality of interface bridges configured to convert a plurality of protocols used by the plurality of chiplets into a common protocol, a routing network configured to route traffic between the plurality of interface bridges using the common protocol, and a controller configured to program the plurality of interface bridges and the routing network based on types of the plurality of chiplets connected to the NoPK. The NoPK may provide a scalable connection for any number of chiplets from different ecosystems using different communication protocols.
Bibliography:Application Number: TW202211115207