Die with a die structure as well as method for its production

A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are comprised at least partially of a die material with low adhesion properties.

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Bibliographic Details
Main Author CHOUIKI, MUSTAPHA
Format Patent
LanguageChinese
English
Published 21.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are comprised at least partially of a die material with low adhesion properties.
Bibliography:Application Number: TW202211123308