Solder resist composition, dry film, printed wiring board and method for producing them
The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion,...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.10.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion, solder heat resistance, pencil hardness, solvent resistance, HAST resistance, and high reflectance and high gloss after a HAST test; a dry film and a printed wiring board which include a solder resist layer obtained therefrom; and methods for manufacturing same. The solder resist composition according to the present invention can provide a dry film and a printed wiring substrate which have a solder resist layer, wherein the solder resist layer has excellent sensitivity, developability, adhesion, solder heat resistance, and solvent resistance, has high reflectance, experiences only a small decrease in reflectance even after high-temperature reflow and UV post-curing, experiences only a small decrease in reflectance |
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Bibliography: | Application Number: TW202110146648 |