Abstract An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
AbstractList An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
Author HAYASHIDE, AKIKO
CHABANA, KOICHI
AKIYOSHI, TOSHIYASU
SUGAWARA, TAKEHIRO
SATOU, MAKOTO
Author_xml – fullname: SUGAWARA, TAKEHIRO
– fullname: SATOU, MAKOTO
– fullname: CHABANA, KOICHI
– fullname: HAYASHIDE, AKIKO
– fullname: AKIYOSHI, TOSHIYASU
BookMark eNrjYmDJy89L5WTgCgn3tDC0sDQ0dOJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEIDU7GRCgBALx3HUM
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID TWI818911BB
GroupedDBID EVB
ID FETCH-epo_espacenet_TWI818911BB3
IEDL.DBID EVB
IngestDate Fri Jul 19 12:56:47 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_TWI818911BB3
Notes Application Number: TW20187121179
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&CC=TW&NR=I818911B
ParticipantIDs epo_espacenet_TWI818911BB
PublicationCentury 2000
PublicationDate 20231021
PublicationDateYYYYMMDD 2023-10-21
PublicationDate_xml – month: 10
  year: 2023
  text: 20231021
  day: 21
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies RESONAC CORPORATION
RelatedCompanies_xml – name: RESONAC CORPORATION
Score 3.6332216
Snippet An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
SourceID epo
SourceType Open Access Repository
SubjectTerms ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
Title TWI818911B
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&locale=&CC=TW&NR=I818911B
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSQFthzQ3S9M1TASPVhkl61oCs5FuklEysP42TjS0AO9y9fUz8wg18YowjWBiyIDthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xqLFiZKjm4mTrGuDv4u-s5uxsGxKu5hdk6wmsmID52omZgRXUiAadsu8a5gTak1KAXKG4CTKwBQDNyisRYmCqyhBm4HSG3bsmzMDhC53uBjKhOa9YhIErJBxmuCiDgptriLOHLtDQeLj74xEKnIzFGFiA3fpUCQYFI1Dlm2aWmmpomQxsFZhagi7HS0wyN04zM7RINU2UZJDEaYwUHjlpBi5QQIDKVyNDGQaWkqLSVFlgxVmSJAf2MwA76W84
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSQFthzQ3S9M1TASPVhkl61oCs5FuklEysP42TjS0AO9y9fUz8wg18YowjWBiyIDthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xqLFiZKjm4mTrGuDv4u-s5uxsGxKu5hdk6wmsmID52omZgdUc2CEEd5TCnEB7UgqQKxQ3QQa2AKBZeSVCDExVGcIMnM6we9eEGTh8odPdQCY05xWLMHCFhMMMF2VQcHMNcfbQBRoaD3d_PEKBk7EYAwuwW58qwaBgBKp808xSUw0tk4GtAlNL0OV4iUnmxmlmhhappomSDJI4jZHCIyfPwOkR4usT7-Pp5y3NwAUKFFBZa2Qow8BSUlSaKgusREuS5MD-BwCT7HIi
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=TWI818911B&rft.inventor=SUGAWARA%2C+TAKEHIRO&rft.inventor=SATOU%2C+MAKOTO&rft.inventor=CHABANA%2C+KOICHI&rft.inventor=HAYASHIDE%2C+AKIKO&rft.inventor=AKIYOSHI%2C+TOSHIYASU&rft.date=2023-10-21&rft.externalDBID=B&rft.externalDocID=TWI818911BB