TWI818911B
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
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| Main Authors | , , , , |
|---|---|
| Format | Patent |
| Language | Chinese |
| Published |
21.10.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less. |
|---|---|
| AbstractList | An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less. |
| Author | HAYASHIDE, AKIKO CHABANA, KOICHI AKIYOSHI, TOSHIYASU SUGAWARA, TAKEHIRO SATOU, MAKOTO |
| Author_xml | – fullname: SUGAWARA, TAKEHIRO – fullname: SATOU, MAKOTO – fullname: CHABANA, KOICHI – fullname: HAYASHIDE, AKIKO – fullname: AKIYOSHI, TOSHIYASU |
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| Notes | Application Number: TW20187121179 |
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| PublicationDateYYYYMMDD | 2023-10-21 |
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| PublicationYear | 2023 |
| RelatedCompanies | RESONAC CORPORATION |
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| Snippet | An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less. |
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| SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| Title | TWI818911B |
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