TWI818911B

An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.

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Bibliographic Details
Main Authors SUGAWARA, TAKEHIRO, SATOU, MAKOTO, CHABANA, KOICHI, HAYASHIDE, AKIKO, AKIYOSHI, TOSHIYASU
Format Patent
LanguageChinese
Published 21.10.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
Bibliography:Application Number: TW20187121179