Substrate processing method and substrate processing apparatus

• Main Authors: IWASAKI, AKIHISA, NUKUI, HIROKI, HIGASHI, KATSUEI, TSUKAHARA, RYUTA, FUJIWARA, NAOKI
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2023
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CLEANING; CLEANING IN GENERAL; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

Provided is a technology of inhibiting occurrence of any problems caused by bubbles in a mixed solution. A substrate processing method comprises a holding process (S1), a mixed solution supplying process (S5), and a substitution process (S8). In the holding process (S1), a substrate is held. In the mixed solution supplying process (S5), a processing solution including water and isopropyl alcohol is supplied, respectively, through a first supply pipe and a second supply pipe and a mixed solution consisting of the processing solution and isopropyl alcohol is discharged from a nozzle to the substrate through a mixing pipe. In the substitution process (S8), a substitute solution which is one of the processing solution and isopropyl alcohol is supplied after the mixed solution supplying process (S5) and the mixed solution in the mixing pipe is pushed by the substitute solution and discharged from the nozzle, thereby substituting the mixed solution with the substitute solution.