Vacuum hold-down apparatus for flattening bowed semiconductor wafers
A vacuum hold-down apparatus retains a wafer in a desired position and orientation. A vacuum chuck assembly of the vacuum hold-down apparatus has a vacuum chuck surface with a vacuum communication aperture. A venturi vacuum generator is fixed with respect to the vacuum chuck assembly and communicate...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
21.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A vacuum hold-down apparatus retains a wafer in a desired position and orientation. A vacuum chuck assembly of the vacuum hold-down apparatus has a vacuum chuck surface with a vacuum communication aperture. A venturi vacuum generator is fixed with respect to the vacuum chuck assembly and communicates with the vacuum chuck surface via the vacuum communication aperture. A positive pressure fluid line communicates with the venturi vacuum generator. |
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Bibliography: | Application Number: TW20209103816 |