Composition, packaging structure, and method of disassembling packaging structure

• Main Authors: SHIEH, TIEN-SHOU, JENG, JAUDER, TSENG, CHI-FU, CHOU, CHIN-HUI
• Format: Patent
• Language: Chinese; English
• Published: 21.07.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; FREQUENCY-CHANGING; HETEROCYCLIC COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-LINEAR OPTICS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; POLISHES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure ofwherein X is -O-,and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.