Surface-treated copper foil and copper clad laminate

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treated surface is 0.4 to 3.0[mu]m. When the surface-treated copper foil is heated at a temperature of 200 DEG C for 1 hour, the ratio of the integrated intensity of (111) peak to the sum of the inte...

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Bibliographic Details
Main Authors LAI, YAO-SHENG, LAI, CHIEN-MING, CHOU, JUIANG
Format Patent
LanguageChinese
English
Published 21.07.2023
Subjects
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Summary:A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treated surface is 0.4 to 3.0[mu]m. When the surface-treated copper foil is heated at a temperature of 200 DEG C for 1 hour, the ratio of the integrated intensity of (111) peak to the sum of the integrated intensities of (111) peak, (200) peak, and (220) peak of the treated surface is at least 60%.
Bibliography:Application Number: TW202110124737