POLYIMIDE, FILM COMPOSITION, AND FILM PREPARED FROM THE SAME

• Main Authors: TSENG, YUNG-LUNG, SU, YU-YANG, SU, CHUN-WEI
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide a polyimide composition that exhibits high-frequency dielectric properties, photosensitivity, and low film-forming temperature.SOLUTION: A photosensitive composition includes 100 pts.wt. of a polyimide, 0.25 to 50 pts.wt. of an initiator, and 0.25 to 100 pts.wt. of a cross-linking agent. The polyimide is a reaction product of a reactant (a) and a reactant (b). The reactant (a) is composed of a first dianhydride with a specific structure and a second dianhydride with a specific structure, wherein the molar ratio of the first dianhydride to the second dianhydride is 3:7 to 8:2. The reactant (b) includes a first diamine with a specific structure.SELECTED DRAWING: None