De-taping apparatus and operating method thereof

A de-taping apparatus includes a movable chuck, a tape provider, a tape path holder, a pressing roller, and a tape receiver. The movable chuck is configured to attach a wafer. The wafer has a membrane. The tape provider is above the movable chuck and includes a roller and a peeling tape winding the...

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Bibliographic Details
Main Authors LAI, JIUN-YEN, CHEN, SHIH KUANG, WEI, JUIING
Format Patent
LanguageChinese
English
Published 21.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A de-taping apparatus includes a movable chuck, a tape provider, a tape path holder, a pressing roller, and a tape receiver. The movable chuck is configured to attach a wafer. The wafer has a membrane. The tape provider is above the movable chuck and includes a roller and a peeling tape winding the roller. The tape path holder is above the movable chuck and downstream the tape provider, and abuts against the peeling tape, and is configured to limit a vertical distance between the membrane and the wafer. The pressing roller is above the movable chuck and downstream the tape path holder, and is configure to move in a direction vertical to the movable chuck to press the peeling tape, such that the peeling tape adheres to the membrane of the wafer. The tape receiver is above the movable chuck and downstream the pressing roller, and is connected to the peeling tape, and is configured to drive and receive the peeling tape.
Bibliography:Application Number: TW202211121122