Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

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Bibliographic Details
Main Authors LEE, YUNG WOO, BANCOD, LUDOVICO E, LANZONE, ROBERT, LEE, JAE UNG, KIM, GI JUNG, ADLAM, EDWIN J, KIM, JIN SEONG, CHOI, MI KYEONG
Format Patent
LanguageChinese
English
Published 01.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Bibliography:Application Number: TW20198101396