Electronic package and manufacturing method thereof

An electronic package in which a first electronic component is embedded in a packaging layer, wherein the first electronic component has an active surface and a non-active surface opposite to the active surface, at least one groove is formed on the non-active surface and extends to a side surface of...

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Bibliographic Details
Main Authors CHEN, LIANG PIN, KE, CHUNG YU
Format Patent
LanguageChinese
English
Published 21.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package in which a first electronic component is embedded in a packaging layer, wherein the first electronic component has an active surface and a non-active surface opposite to the active surface, at least one groove is formed on the non-active surface and extends to a side surface of the encapsulation layer, so that the groove is exposed to the encapsulation layer as an air passage, and a metal layer is formed on the non-acting surface. Therefore, heat generated by the first electronic component during operation is introduced into the air passage by the groove.
Bibliography:Application Number: TW202110125663