TWI796060B
The present invention relates to a wafer adsorption arm, which comprises a body including a connecting part, an adsorption part and a flow channel part, wherein the connecting part is positioned at one end of the top surface and penetrated with a suction hole, the adsorption part is positioned at th...
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Main Author | |
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Format | Patent |
Language | Chinese |
Published |
11.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a wafer adsorption arm, which comprises a body including a connecting part, an adsorption part and a flow channel part, wherein the connecting part is positioned at one end of the top surface and penetrated with a suction hole, the adsorption part is positioned at the other end of the top surface, the adsorption part is formed with a plurality of adsorption channels and a plurality of adsorption holes, one end of each adsorption channel is connected with each other, the other end of each adsorption channel extends outward, each adsorption hole runs through each adsorption channel, the flow channel part is positioned on the bottom surface and recessed with at least one drainage channel, one end of the drainage channel is communicated with each adsorption hole, and the other end of the drainage channel is communicated with the suction hole; and a bottom cover fixed on the bottom surface of the body and covering the drainage channel. When the present invention carries out the suc |
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Bibliography: | Application Number: TW202110148537 |