TWI795503B

Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to the back surface of a semiconductor when in use, and comprises...

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Bibliographic Details
Main Authors SATO, SATOSHI, TAKAMOTO, NAOHIDE, SHIGA, GOSHI
Format Patent
LanguageChinese
Published 11.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to the back surface of a semiconductor when in use, and comprises: a layer A which contains a black pigment and serves as the outermost layer when closely adhered to the back surface of the semiconductor; and a layer B which contains a black pigment and has a higher absorbance at the wavelength of 1,300 nm than the layer A, while serving as an inner layer that is positioned between the outermost layer and a semiconductor element when closely adhered to the back surface of the semiconductor.
Bibliography:Application Number: TW20187147732