Method of manufacturing a light emitting diode and light emitting diode assembly

• Main Author: OYER, CELINE CLAIRE
• Format: Patent
• Language: Chinese; English
• Published: 11.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments relate to fabricating a display device by assembling strips of μLED devices onto a backplane instead of individually picking and placing each μLED device onto the backplane. A strip of first μLED devices is coupled to a set of interconnections on the backplane. Then, the first fabrication substrate is removed from the strip of first μLED devices. A strip of second μLED devices producing another color (e.g., green) is attached to a second fabrication substrate. The strip of second μLED devices is coupled to another set of interconnections on the backplane. The process may be repeated for a strip of third μLED devices producing yet another color (e.g., blue). After attaching the second and third μLED devices, fabrication substrates on the second and third μLED devices are simultaneously removed by laser based lift-off (LLO) method.