ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress conce...

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Bibliographic Details
Main Authors FU, YI MIN, HO, CHI CHING, PU, CHAO CHIANG, WANG, YU PO
Format Patent
LanguageChinese
English
Published 21.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.
Bibliography:Application Number: TW202211104761