TWI784392B

Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.

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Bibliographic Details
Main Authors SCHULZ, DARIAN, SULLIVAN, JARED D, JONES, ERAN J, WARD, TODD D, GADER, DAVID, MCGEE, MICHAEL, WEHRLI, ANDREW J, BARDELLA, GIANNI R, ISAAC, AYMAN
Format Patent
LanguageChinese
Published 21.11.2022
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Summary:Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
Bibliography:Application Number: TW202110101450