TWI784392B
Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | Chinese |
Published |
21.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path. |
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Bibliography: | Application Number: TW202110101450 |