TWI781144B

A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the f...

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Bibliographic Details
Main Authors KOIBUCHI, YUKARI, NAMATAME, YUTAKA, SAITO, NOBUYUKI
Format Patent
LanguageChinese
Published 21.10.2022
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Summary:A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
Bibliography:Application Number: TW20187106045