METHOD FOR TRANSFERRING ELECTRONIC DEVICE

• Main Authors: HUANG, SHENG CHE, LIN, CHINGJU, HUANG, YU-MIN, WANG, WEI-HAO
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method for transferring electronic device includes the following steps: providing a flexible carrier with a plurality of electronic devices on a surface; providing a target substrate configured to be corresponding to the surface of the flexible carrier; providing a pin, and a pin end of the pin is pressed on the other surface of the flexible carrier, which is not the surface on which the electronic device is disposed, so that the flexible carrier is deformed, causing the electronic device to move to the target substrate and contact it; providing a light beam to transmit at least a portion of the pin and emit from the pin end to melt a solder, and the electronic device is fixed on the target substrate by soldering; and moving the pin to restore the flexible carrier to its original shape, and make the electronic device fixed by soldering separate from the carrier.