Method, computer program product, semiconductor inspection device of obtaining a 3d volume image of an integrated semiconductor sample

A three-dimensional circuit pattern inspection technique includes cross sectioning integrated circuits for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample....

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Main Authors NEUMANN, JENS TIMO, AVISHAI, AMIR, BUXBAUM, ALEX, LEE, KEUMSIL, SCHULMEYER, INGO, FOCA, EUGEN, KLOCHKOV, DMITRY, KORB, THOMAS
Format Patent
LanguageChinese
English
Published 01.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:A three-dimensional circuit pattern inspection technique includes cross sectioning integrated circuits for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample. A computer program product and apparatus are provided.
Bibliography:Application Number: TW20209118306