TWI775373B

• Main Authors: IWAI, Akiko, MORIYA, Toshimitsu, IZAWA, Hiroyuki, TANAKA, Masaru
• Format: Patent
• Language: Chinese
• Published: 21.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention provides a method for producing a connected structure, which comprises a connection step for connecting a substrate 5 and a circuit component 4 having a projected electrode 42 with an anisotropic conductive film 9 being interposed therebetween, said anisotropic conductive film 9 being obtained by dispersing conductive particles 7 in an adhesive layer 8. With respect to the anisotropic conductive film 9, the conductive particles 7 are unevenly gathered in one surface of the anisotropic conductive film 9. The connection step comprises a temporary fixing step wherein the anisotropic conductive film 9 is arranged between the circuit component 4 and the substrate 5 such that the above-described one surface faces the substrate 5, and the projected electrode 42 is pressed into the anisotropic conductive film 9 so that the distance d between a surface 42a of the projected electrode 42 and a surface 5a of the substrate 5 is 150% or less of the average particle diameter of the conductive particles