CHIP PACKAGING STRUCTURE WITH ELECTROMAGNETIC SHIELDING AND FORMING METHOD THEREOF

• Main Author: TSAI, MINGANG
• Format: Patent
• Language: Chinese; English
• Published: 21.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A chip package structure with electromagnetic shielding, comprising: a substrate, a window with through the upper surface and the lower surface of the substrate, a plurality of conductive structures in the substrate, and the active surface of each plurality of chip package structures are arranged on the upper surface corresponding to the window, a conductive wire is electrically connected to the each chip package structures with the lower surface of the substrate through the window, the insulating layer is arranged on the back surface of each chip package structure and sidewall of each chip package structure, and is covered part of the upper surface of the substrate. The shielding layer is arranged on the insulating layer and on the upper surface of the substrate which is extended to electrically connect to the portion of conductive structure exposed to the upper surface of the substrate. An encapsulation layer is covered the shielding layer and the upper surface of the substrate and covers the window and par