TWI771907B

[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprisin...

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Main Authors TAKAHASHI, MEGUMI, YOKOYAMA, DAISHI, TANIGUCHI, KATSUTO, YOSHIDA, NAOFUMI, KUZAWA, MASAHIRO
Format Patent
LanguageChinese
Published 21.07.2022
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Summary:[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative a compound generating acid or base when exposed to heat or light; and a solvent.
Bibliography:Application Number: TW202110104966