TWI771907B
[Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprisin...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese |
Published |
21.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | [Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative a compound generating acid or base when exposed to heat or light; and a solvent. |
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Bibliography: | Application Number: TW202110104966 |