TWI771529B

To provide a general-purpose mounting substrate that can correspond to LED chips of different sizes and has no problem of LED chip misalignment or excessive bonding material spreading.SOLUTION: The general-purpose mounting substrate is provided with a mounting pad 13 formed for joining any of a plur...

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Bibliographic Details
Main Author OIKAWA, TOSHIHIRO
Format Patent
LanguageChinese
Published 21.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a general-purpose mounting substrate that can correspond to LED chips of different sizes and has no problem of LED chip misalignment or excessive bonding material spreading.SOLUTION: The general-purpose mounting substrate is provided with a mounting pad 13 formed for joining any of a plurality of semiconductor light emitting elements having different sizes. The mounting pad 13 has a first area 131 and a second area 132 located inside the first area 131. A step is formed between the first area 131 and the second area 132. Since the area is determined by the step, a displacement of an LED chip is prevented. Furthermore, an excess bonding material does not spread to a substrate side.SELECTED DRAWING: Figure 2
Bibliography:Application Number: TW20187141395