TWI771529B
To provide a general-purpose mounting substrate that can correspond to LED chips of different sizes and has no problem of LED chip misalignment or excessive bonding material spreading.SOLUTION: The general-purpose mounting substrate is provided with a mounting pad 13 formed for joining any of a plur...
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Main Author | |
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Format | Patent |
Language | Chinese |
Published |
21.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a general-purpose mounting substrate that can correspond to LED chips of different sizes and has no problem of LED chip misalignment or excessive bonding material spreading.SOLUTION: The general-purpose mounting substrate is provided with a mounting pad 13 formed for joining any of a plurality of semiconductor light emitting elements having different sizes. The mounting pad 13 has a first area 131 and a second area 132 located inside the first area 131. A step is formed between the first area 131 and the second area 132. Since the area is determined by the step, a displacement of an LED chip is prevented. Furthermore, an excess bonding material does not spread to a substrate side.SELECTED DRAWING: Figure 2 |
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Bibliography: | Application Number: TW20187141395 |