Semiconductor structure and mthhod of forming the same

A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second in...

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Bibliographic Details
Main Authors HUANG, PING-KANG, HOU, SHANG-YUN, WU, CHI-HSI, SHEN, CHIH-TA, LU, SZU-WEI, CHIU, SAO-LING, HU, HSIEN-PIN, WEI, WEN-HSIN, CHIOU, WENIH, SHIH, YINGING, YU, CHEN-HUA
Format Patent
LanguageChinese
English
Published 11.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
Bibliography:Application Number: TW20209131934